| Item | Speci. |
|---|---|
| Layers | 1-36 layers |
| Materials | FR-4, CEM-3, Rogers, High TG,High Speed,High Frequency ,High Thermal Conductivity |
| Board Thickness | 0.1mm-7.0mm |
| Copper Thickness | 0.5-7.0OZ depends on design and material requirements |
| Min Line Width | 3mil(0.075mm) |
| Minimum Hole Size | 0.075mm |
| Max Panel Size | 32"×48"(800mm×1200mm) |
| Surface Finish | HAL(with Pb free), Plated Ni/Au, ENIG Immersion Tin, Immersion Ag, OSP,etc |
| Solder Mask | Green/Yellow/Black/White/Red/Blue and other colors |
| Solder Mask Resolution | 4mil (0.1mm) minimum |
| Min PAD | 5mil(0.13mm) |
| Hole Tolerance | PTH：±0.05 NPTH：±0.025 |
| Outline Tolerance | ±0.075mm |
| Silkscreen Color | Red/Yellow/Black/White |
| Plated Through Holes (PTH) | Yes |
| Blind & Buried Vias (BBV) | Yes |
| Via-in-Pad | Yes |
| Controlled Impedance | Yes |
| Routing & Scoring | V-cut / Tab-routing/ Individual routing |
| Electrical Testing | Continuity & isolation, impedance control, Hi-Pot, etc. |
| Special Request | Blind hole+Gold finger + BGA |
| Certification | UL, IATF16949, ISO, RoHs&Reach |
| Material Suppilers | Isola：FR408、FR408HR、IS410、PCL-370HR；联茂：IT-180A、IT-150DA；Nelco：N4000-13、N4000-13EP、N4000-13SI、N4000-13EP SI；松下:R-5775K（Megtron6）R-5725（Megtron4）台耀：TU-768、TU-662；腾辉：VT-47； |
If you have any requirements for PCB/ PCBA/Components, please contact us and we will reply to you as soon as possible!
- +86 0755-36991755
- +86 18129811045
- +86 0755-36991755
- sales@secircuit.com
Manufacturing of Rigid PCB
It is necessary to check with the printed circuit board manufacturer the presence or availability of construction materials planned for use in the project, and their technological compatibility in the manufacture of the product.
Of great importance is the possibility of multiplying the boards on the workpiece and the choice of the optimal size of the workpiece, since this determines the consumption of construction and technological materials, and therefore the cost of the product.
Before starting the development of a serial product, it is necessary to clarify with the manufacturer what dimensions of multi-workpieces (rigid dielectric with a metal layer on which the maximum possible number of rigid printed circuit boards is located) can be processed on technological equipment and what is the size of the working area on the workpiece.
The efficiency of the use of group workpieces becomes important when the volume of production increases. The cost of the board will be lower; more modules can be placed on the workpiece and subjected to group processing. It is necessary to check with the manufacturer the width and length of the roll of material available to him, since, depending on the thickness of the material and the type of equipment, the dimensions of the blanks can vary significantly.
The following factors should be taken into account in rigid pcb manufacturing:
- distance between elements;
- the presence of test points that allow you to control the technological process and the resistance of the conductors;
- mounting holes;
- reference points;
- distance between modules;
- multiplication possibilities;
- Requirements for the presence of a frame for metalizing holes.
